Lead-Free Solder Products From Kester And Indium
Kester NXG33 Lead-Free Solder Paste
Kester NXG33 Lead-Free Solder Paste is designed to exceed customers’ expectations for high yield lead-free manufacturing. NXG33 is engineered for the high thermal demands of assembling with lead-free alloys. Joints are cosmetically as bright as SnPb joints. Prints down to 01005 pad sites. Designed to be reflowable in air as well as nitrogen. Post soldering, NXG33 offers minimized defects, including head-in-pillow and QFN/BGA voiding.Read more
Indium 8.9 Lead-Free Solder Paste
Indium 8.9 is an air or nitrogen reflow, no-clean lead-free solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. Indium 8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.Read more
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